Wang, L., Chung, K. L., Sun, P., & Ji, L. (2024). A Novel DM-RPA-Based Strain Sensor for High-Sensitivity 2-Dimensionsal Strain Monitoring. 2024 IEEE 7th International Conference on Electronic Information and Communication Technology (ICEICT), Electronic Information and Communication Technology (ICEICT), 2024 IEEE 7th International Conference on, 1452-1454. https://doi.org/10.1109/ICEICT61637.2024.10671090
Chicago-referens (17:e uppl.)Wang, Lingling, Kwok L. Chung, Ping Sun, och Lunlong Ji. "A Novel DM-RPA-Based Strain Sensor for High-Sensitivity 2-Dimensionsal Strain Monitoring." 2024 IEEE 7th International Conference on Electronic Information and Communication Technology (ICEICT), Electronic Information and Communication Technology (ICEICT), 2024 IEEE 7th International Conference on 2024: 1452-1454. https://doi.org/10.1109/ICEICT61637.2024.10671090.
MLA-referens (9:e uppl.)Wang, Lingling, et al. "A Novel DM-RPA-Based Strain Sensor for High-Sensitivity 2-Dimensionsal Strain Monitoring." 2024 IEEE 7th International Conference on Electronic Information and Communication Technology (ICEICT), Electronic Information and Communication Technology (ICEICT), 2024 IEEE 7th International Conference on, 2024, pp. 1452-1454, https://doi.org/10.1109/ICEICT61637.2024.10671090.
