APA (7th ed.) Citation

Li, J., Liang, H., Dou, X., Yu, L., Huang, Z., Lu, Y., & Jiang, C. (2024). Machine Learning-Based Diagnosis of Defects in Chiplet Interconnects. 2024 International 3D Systems Integration Conference (3DIC), 3D Systems Integration Conference (3DIC), 2024 International, 1-6. https://doi.org/10.1109/3DIC63395.2024.10830028

Chicago Style (17th ed.) Citation

Li, Junming, Huaguo Liang, Xianrui Dou, Le Yu, Zhengfeng Huang, Yingchun Lu, and Cuiyun Jiang. "Machine Learning-Based Diagnosis of Defects in Chiplet Interconnects." 2024 International 3D Systems Integration Conference (3DIC), 3D Systems Integration Conference (3DIC), 2024 International 2024: 1-6. https://doi.org/10.1109/3DIC63395.2024.10830028.

MLA (9th ed.) Citation

Li, Junming, et al. "Machine Learning-Based Diagnosis of Defects in Chiplet Interconnects." 2024 International 3D Systems Integration Conference (3DIC), 3D Systems Integration Conference (3DIC), 2024 International, 2024, pp. 1-6, https://doi.org/10.1109/3DIC63395.2024.10830028.