Ying, C., Zebing, H., & Rui, K. (2010). Lifetime prediction and impact factors analysis of ball grid array solder joint based on FEA. 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on, 1142-1146. https://doi.org/10.1109/ICEPT.2010.5582746
Chicago-referens (17:e uppl.)Ying, Chen, Hou Zebing, och Kang Rui. "Lifetime Prediction and Impact Factors Analysis of Ball Grid Array Solder Joint Based on FEA." 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on 2010: 1142-1146. https://doi.org/10.1109/ICEPT.2010.5582746.
MLA-referens (9:e uppl.)Ying, Chen, et al. "Lifetime Prediction and Impact Factors Analysis of Ball Grid Array Solder Joint Based on FEA." 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on, 2010, pp. 1142-1146, https://doi.org/10.1109/ICEPT.2010.5582746.
