APA (7th ed.) Citation

Ying, C., Zebing, H., & Rui, K. (2010). Lifetime prediction and impact factors analysis of ball grid array solder joint based on FEA. 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on, 1142-1146. https://doi.org/10.1109/ICEPT.2010.5582746

Chicago Style (17th ed.) Citation

Ying, Chen, Hou Zebing, and Kang Rui. "Lifetime Prediction and Impact Factors Analysis of Ball Grid Array Solder Joint Based on FEA." 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on 2010: 1142-1146. https://doi.org/10.1109/ICEPT.2010.5582746.

MLA (9th ed.) Citation

Ying, Chen, et al. "Lifetime Prediction and Impact Factors Analysis of Ball Grid Array Solder Joint Based on FEA." 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on, 2010, pp. 1142-1146, https://doi.org/10.1109/ICEPT.2010.5582746.