APA (7th ed.) Citation

Li, Q., Li, C., Wang, X., Cai, S., Peng, J., Chen, S., . . . Yuan, X. (2024). Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging. Acta Metallurgica Sinica (English Letters), 37(7), 1279-1290. https://doi.org/10.1007/s40195-024-01691-3

Chicago Style (17th ed.) Citation

Li, Quanzhen, Chengming Li, Xiaojing Wang, Shanshan Cai, Jubo Peng, Shujin Chen, Jiajun Wang, and Xiaohong Yuan. "Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint Under Isothermal Aging." Acta Metallurgica Sinica (English Letters) 37, no. 7 (2024): 1279-1290. https://doi.org/10.1007/s40195-024-01691-3.

MLA (9th ed.) Citation

Li, Quanzhen, et al. "Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint Under Isothermal Aging." Acta Metallurgica Sinica (English Letters), vol. 37, no. 7, 2024, pp. 1279-1290, https://doi.org/10.1007/s40195-024-01691-3.