APA (7th ed.) Citation

Yu, C., Peng, J., Hsiao, C., Wang, C., & Lo, W. (2025). Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging. Micromachines, 16(3), 342. https://doi.org/10.3390/mi16030342

Chicago Style (17th ed.) Citation

Yu, Ching-Feng, Jr-Wei Peng, Chih-Cheng Hsiao, Chin-Hung Wang, and Wei-Chung Lo. "Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging." Micromachines 16, no. 3 (2025): 342. https://doi.org/10.3390/mi16030342.

MLA (9th ed.) Citation

Yu, Ching-Feng, et al. "Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging." Micromachines, vol. 16, no. 3, 2025, p. 342, https://doi.org/10.3390/mi16030342.