Yu, C., Peng, J., Hsiao, C., Wang, C., & Lo, W. (2025). Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging. Micromachines, 16(3), 342. https://doi.org/10.3390/mi16030342
Chicago-referens (17:e uppl.)Yu, Ching-Feng, Jr-Wei Peng, Chih-Cheng Hsiao, Chin-Hung Wang, och Wei-Chung Lo. "Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging." Micromachines 16, no. 3 (2025): 342. https://doi.org/10.3390/mi16030342.
MLA-referens (9:e uppl.)Yu, Ching-Feng, et al. "Development of GUI-Driven AI Deep Learning Platform for Predicting Warpage Behavior of Fan-Out Wafer-Level Packaging." Micromachines, vol. 16, no. 3, 2025, p. 342, https://doi.org/10.3390/mi16030342.
